Researchers at SEMATECH North have reached a significant milestone in reducing deposition tool-generated defects in mask blanks used for extreme ultraviolet lithography (EUVL), bringing that technology a step closer to commercial feasibility.
Technologists from SEMATECH, Veeco Instruments Inc. (NASDAQ: VECO), and Asahi Glass achieved an extremely low level of added defects in recent work with Veeco's NEXUS system, an ion beam deposition (IBD) low defect density (LDD) tool for deposition of critical films. Following a two-year effort to improve tool hardware, process parameters and handling protocols, the technologists deposited EUV multilayers with as few as one defect per mask at 80 nm resolution, which translates into 0.005 defects per square centimeter. A state-of-the-art laser-based defect detection system was used to identify the defects.
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